A new technical paper entitled “Modeling Chiplet-to-Chiplet (C2C) Communication for chiplet-based co-design” was published by researchers at Peter Grunberg Institute and the Jüloich Super Computing Centers.
Abstract
“On chiplet-based processor design, which combines small stamps, which are referred to as chip places as a larger chip, enables scalable designs at economic costs. This trend has received a lot of attention, so that the standards for chiplet design have quickly determined, including packaging, protocols and chip-to-chiplet interfaces, with numerous, well-defined Chiplet-Design-Decials-Design-Decials Decial DECI options.
Here you will find the technical paper. May 2025.
F. Gerim 1-11.