The 3 dress caliber provides an early analysis/simulation of chip/package interactions in all phases of the design process.
The Siemens Digital Industries software has added two new tools to the electronics design -automation -automation portfolio (EDA) to support the design and production of 2.5D and 3D integration circuits (ICS). With the Innovator3d IC Solution Suite, IC designer can simulate and manage heterogeneously integrated 2.5d/3D -ic designs. The Kaliber-3dress software uses thermomechanical analysis to determine how stress can affect the electrical performance at the transistor level. These tools are intended to support more effective design and manufacturing processes for advanced ICS.
Innovator3d IC Solution Suite
The new Innovator3D IC solution from Siemens offers a quick, predictable path for planning and heterogeneous integration, substrate/interposer implementation, compliance with interface protocol analysis and data management of designs and design data IP.
The new Innovator3D IC solution suite consists of a user experience enriched by AI that offers extensive multithreading and multicore functions in order to achieve optimal capacity and performance at 5 million PIN designs, and consists of the Innovator3D IC integrator, a consolidated cockpit for the construction of a digital twin using a uniform Data model for design planning, protototing and prediction and forecasting and forecast and forecast and forecast for planning, protototing and forecasting and analysis. the Innovator3D IC layout solution for interposer and substrate implementation of correct-by-construction package; the Innovator3D IC protocol analyzer for chiplet-to-chiplet and the compliance analysis of the interface to the interface; and the Innovator3d IC Data Management solution for the labor management of designs and design data IP.
Kaliber 3DStress
With the thinner stamping temperatures and the higher package processing temperatures of 2.5d/3D -ic architectures, IC designers have found that designs that were validated and tested at the stamp level often no longer correspond to the specifications after the packaging loss.
The Kaliber 3DStress develops in order to counter this challenge, supports a precise analysis, review and debugge of thermomechanical stress and considerations at transistor level in connection with 3D-IC packaging, so that chip designers can evaluate how the interaction of the chip package in the development cycle previously affects the functionality of their designs. This foresight not only prevents future failures, but also optimizes the design for better performance and durability.
Caliber 3dress extends the start of caliber 2024 and adds the multiphysics solution from Siemens by enabling previous visibility to design and electrical behavior. In contrast to voltage tools on a package level, tension is identified at the transistor level to ensure that packaging processes and product functions do not affect the circuit performance.
The Kaliber 3DPress represents an important part of the 3D IC multi-physics software portfolio of Siemens and a fundamental part of the work processes by Siemens' IC Digital Twin and Semiconductor Development. It provides an innovative combination of physical check functionality of the industry standard with a native and highly advanced mechanical solver in order to evaluate tensions in IC structures and materials.
Further information on Siemens' wide solution portfolio for 2.5D/3D-IC architectures can be found at Eda.sw.siemens.com/en-us/ic-packaging/3d-ic-Design.