A research team from the University of Twente in the Netherlands has developed a 3D printing solution that aims to improve thermal management in smaller, more powerful microchips and to receive the thematic technology transfer proof of concept (TTT-POC). The technology aims at power restrictions in compact chippakets, while energy consumption in connection with cooling is reduced.
“We have to cope with basic and technical challenges in the characterization of metallurgy, addiction and advanced materials. This is the ideal moment to promote and commercialize our technology and to position them for integration into future advanced packaging platforms,” said Dr. Shirin Dehgahi, Lead Investigator and Postdoctoral Fellow at the University of Twente.
Validation and scaling the technology via the value chain of microelectronics
The team found that the miniaturization of the semiconductor increases the functionality in smaller components, but also generates more heat, which can affect reliability and lifespan. “The improvement of energy efficiency alone is not sufficient; the advanced thermal management has become essential to enable the next generation of innovations,” said the researchers.
The technology is validated across the entire value chain, whereby the cooperation between designers and manufacturers is working together at the level of the expenses, the package and the system. “This chain -wide approach will help identify the most effective applications and to support the development of microelectronics,” added the team.
3D printing, the broader innovation drives in microelectronics
The work of the Dutch team is part of a wider trend of 3D printing in the microelectronics sector. In 2024, Exaddon, Micro 3D printing company in Switzerland, developed the world's first 3D-microprovated probes that were able to examine a fine copy with a pitch of less than 20 µm. Fine-Pitch sondent tests are an extremely complex and precise process that is used to test semiconductor disorders. The Exaddon -Hohen conductivity probes are optimized for semiconductor -wafer tests and are printed 3D directly on adaptable and interchangeable room transformers. This reduces complexity, costs and the number of component layers required.
Elsewhere, researchers from the Massachusetts Institute of Technology (with) showed a breakthrough in 3D printing by creating completely 3D -printed, retrospectable backups and key components in active electronics. These devices were typically dependent on advanced semiconductor manufacturing processes and were produced using standard -3D printing hardware and an inexpensive, biodegradable polymer material, which was infused with copper nanoparticles. Partial financed by the Empiriko Corporation, this development could finally bring electronics production in companies, laboratories and houses worldwide.
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The picture presented shows the USB -compatible sensor with a microchip. Image about Duke Health.